| سال | هفته | ID | Title | ApplNo | IPC | Applicant | Subgroup | زیر گروه | رشته | شرح | Description |
|---|
2025 | 48 | WO/2025/199997 | LIGHT-EMITTING SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY DEVICE | CN2024/084978 | H01L 33/24 | BOE TECHNOLOGY GROUP CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/241051 | DEVICE COOLING AND ELECTROMAGNETIC INTERFERENCE SHIELDING SYSTEM | CN2024/094124 | H01L 23/552 | QUALCOMM INCORPORATED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/241114 | APPARATUS AND METHOD FOR THE ALIGNMENT OF A SUBSTRATE SUPPORT | CN2024/094753 | H01L 21/68 | APPLIED MATERIALS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/241276 | LIGHT-EMITTING DEVICE, LAMP PANEL AND DISPLAY APPARATUS | CN2024/104658 | H01L 25/16 | HGC (WUHAN) TECHNOLOGY CO., LTD | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/241317 | CASSETTE-FREE CLEANING METHOD FOR ULTRATHIN FZ SILICON WAFER | CN2024/110878 | H01L 21/02 | SHANGHAI SEMICONDUCTOR WAFER TECHNOLOGY CO., LTD | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/241382 | PHOTOVOLTAIC MODULE | CN2024/124260 | H01L 31/048 | SHENZHEN HELLO TECH ENERGY CO., LTD | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/241395 | SEMICONDUCTOR STRUCTURE, AND SEMICONDUCTOR DEVICE AND FORMING METHOD THEREFOR | CN2024/126302 | H01L 23/31 | CXMT CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/241706 | RADIO FREQUENCY FRONT-END ASSEMBLY, RADIO FREQUENCY TRANSCEIVING SYSTEM AND COMMUNICATION DEVICE | CN2025/085928 | H01L 25/16 | HUAWEI TECHNOLOGIES CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/241784 | REST-STATE BIO-OPTICAL SPECTRUM LED LIGHT SOURCE AND MANUFACTURING METHOD THEREFOR | CN2025/089343 | H01L 25/075 | DONGGUAN LEDESTAR OPTOELECTRONICS TECHNOLOGY CO., LTD | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/241785 | BIO-FRIENDLY LIGHT SPECTRUM LED LIGHT SOURCE FOR WORK AND OFFICE ENVIRONMENTS, AND MANUFACTURING METHOD THEREFOR | CN2025/089349 | H01L 25/075 | DONGGUAN LEDESTAR OPTOELECTRONICS TECHNOLOGY CO., LTD | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/241786 | STUDY-STATE BIO-OPTICAL SPECTRUM LED LIGHT SOURCE AND MANUFACTURING METHOD THEREFOR | CN2025/089350 | H01L 25/075 | DONGGUAN LEDESTAR OPTOELECTRONICS TECHNOLOGY CO., LTD | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/241820 | 3D VERTICAL INTERCONNECTION PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR | CN2025/090653 | H01L 21/768 | SJ SEMICONDUCTOR (JIANGYIN) CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/241846 | EMBEDDED PACKAGING STRUCTURE, POWER SUPPLY, AND MANUFACTURING METHOD | CN2025/091751 | H01L 25/16 | HUAWEI TECHNOLOGIES CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/241893 | 3D VERTICAL INTERCONNECTION PACKAGING STRUCTURE AND PREPARATION METHOD THEREFOR | CN2025/093607 | H01L 21/768 | SJ SEMICONDUCTOR (JIANGYIN) CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/241894 | PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR | CN2025/093614 | H01L 23/31 | SJ SEMICONDUCTOR (JIANGYIN) CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/241905 | LIGHT-EMITTING ELEMENT PICKUP SEQUENCE DETERMINATION METHOD, LIGHT-EMITTING ELEMENT PICKUP METHOD, LIGHT-EMITTING ELEMENT TRANSFER METHOD, APPARATUS, DEVICE AND MEDIUM | CN2025/093725 | H01L 21/67 | BOE TECHNOLOGY GROUP CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/241940 | BEARING APPARATUS AND SEMICONDUCTOR PROCESSING DEVICE | CN2025/094507 | H01L 21/683 | BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/241974 | WAFER TRANSFER SYSTEM | CN2025/095027 | H01L 21/677 | ETA-SEMITECH (ZHEJIANG) CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/242266 | METHOD FOR PRODUCING AN ARRAY COMPRISING UV LIGHT-EMITTING DIODES, AND ARRAY | DE2025/100471 | H01L 25/075 | MSG LITHOGLAS GMBH | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/242350 | APPARATUS AND METHOD FOR CONTINUOUS DIE BONDING | EP2025/059090 | H01L 21/67 | ASML NETHERLANDS B.V. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/242628 | COOLER FOR COOLING POWER SEMICONDUCTORS | EP2025/063746 | H01L 21/48 | ROBERT BOSCH GMBH | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/242641 | COOLER ARRANGEMENT AND METHOD FOR PRODUCING SAME | EP2025/063779 | H01L 23/367 | ROBERT BOSCH GMBH | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/242966 | TEST STRUCTURE AND FABRICATING METHOD THEREOF | FI2025/050265 | H01L 21/66 | CHIPMETRICS OY | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/243384 | SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE | JP2024/018627 | H01L 23/40 | MITSUBISHI ELECTRIC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/243391 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | JP2024/018675 | H01L 29/778 | MITSUBISHI ELECTRIC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/243406 | POWER CONVERSION DEVICE | JP2024/018730 | H01L 23/48 | ASTEMO, LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/243478 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, AND RESIN SET FOR SEALING AND UNDERFILL FORMATION IN SEMICONDUCTOR CHIP COMPONENT | JP2024/019078 | H01L 23/31 | RESONAC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/243527 | SEMICONDUCTOR DEVICE | JP2024/019248 | H01L 23/12 | RESONAC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/243529 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, THERMOSETTING ADHESIVE FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR MODULE | JP2024/019251 | H01L 23/12 | RESONAC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/243602 | COOLING STRUCTURE | JP2025/002463 | H01L 23/473 | HITACHI, LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/243620 | ELECTRONIC COMPONENT EQUIPPED WITH ADHESIVE SHEET, AND TRANSFER SHEET | JP2025/005373 | H01L 21/301 | RESONAC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/243629 | ELECTRON BEAM LITHOGRAPHY DEVICE AND ELECTRON BEAM LITHOGRAPHY METHOD | JP2025/006000 | H01L 21/027 | NUFLARE TECHNOLOGY, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/243727 | POWER SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE | JP2025/014493 | H01L 23/467 | MITSUBISHI ELECTRIC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/243738 | FILM THICKNESS MEASUREMENT METHOD | JP2025/014947 | H01L 21/306 | SCREEN HOLDINGS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/243743 | METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, WAFER LAMINATE, AND SEMICONDUCTOR CHIP | JP2025/015077 | H01L 21/301 | KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/243744 | METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER, AND SEMICONDUCTOR WAFER | JP2025/015078 | H01L 21/301 | KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHO | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/243755 | SUBSTRATE TRANSPORT SYSTEM | JP2025/015476 | H01L 21/677 | KAWASAKI JUKOGYO KABUSHIKI KAISHA | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/243782 | GAS SUPPLY DEVICE, GAS SUPPLY SYSTEM, AND GAS SUPPLY METHOD | JP2025/015963 | H01L 21/205 | TAIYO NIPPON SANSO CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/243783 | GAS SUPPLY DEVICE, GAS SUPPLY SYSTEM, AND GAS SUPPLY METHOD | JP2025/015964 | H01L 21/205 | TAIYO NIPPON SANSO CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/243784 | GAS SUPPLY DEVICE, GAS SUPPLY SYSTEM, AND GAS SUPPLY METHOD | JP2025/015965 | H01L 21/205 | TAIYO NIPPON SANSO CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/243813 | PACKAGE, LEAD FRAME, AND METHOD FOR MANUFACTURING PACKAGE | JP2025/016462 | H01L 23/02 | SONY SEMICONDUCTOR SOLUTIONS CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/243917 | SURFACE TREATMENT METHOD FOR SEMICONDUCTOR SUBSTRATE, LIQUID COMPOSITION, AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE | JP2025/017656 | H01L 21/304 | MITSUBISHI GAS CHEMICAL COMPANY, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/243968 | BONDING DEVICE AND CONTROL METHOD | JP2025/017966 | H01L 21/60 | PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/244050 | CLEANING LIQUID COMPOSITION | JP2025/018316 | H01L 21/304 | KANTO KAGAKU KABUSHIKI KAISHA | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/244066 | SILICON ELECTRODE PLATE FOR PLASMA PROCESSING APPARATUS AND METHOD FOR MANUFACTURING SAME | JP2025/018439 | H01L 21/3065 | MITSUBISHI MATERIALS CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/244104 | METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, AND RESIN SET FOR SEALING AND UNDERFILL FORMATION IN SEMICONDUCTOR CHIP COMPONENT | JP2025/018599 | H01L 21/60 | RESONAC CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/244145 | DISPLAY DEVICE INCLUDING SEMICONDUCTOR LIGHT-EMITTING ELEMENTS | KR2024/006786 | H01L 25/075 | LG ELECTRONICS INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/244227 | COOLING DUCT FOR HUMIDITY CONTROL | KR2024/096581 | H01L 21/67 | YEST CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/244308 | PROCESS MONITORING SYSTEM AND METHOD USING AUTOMATED SYSTEM AND WIRELESS CHARGING | KR2025/005559 | H01L 21/67 | WIT CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/244346 | LOAD LOCK CHAMBER AND SUBSTRATE PROCESSING APPARATUS INCLUDING SAME | KR2025/006543 | H01L 21/67 | PSK INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/244473 | TRANSPARENT DISPLAY DEVICE | KR2025/007049 | H01L 23/00 | YAS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/244474 | TRANSPARENT DISPLAY DEVICE | KR2025/007050 | H01L 23/00 | YAS CO., LTD. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/244601 | A METHOD FOR COMPLETELY CLEANING THE DIE SEPARATION TAPE FROM THE DIE SURFACE | TR2024/051741 | H01L 21/3065 | BILKENT UNIVERSITESI ULUSAL NANOTEKNOLOJI ARASTIRMA MERKEZI | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/244626 | COMPOSITE THERMAL HOTSPOT MANAGEMENT IN DIE PACKAGING | US2024/030242 | H01L 23/373 | DIAMOND FOUNDRY INCORPORATED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/244725 | STRESS CONTROL OF HIGH-DENSITY CARBON HARDMASK (CHM) | US2025/019786 | H01L 21/033 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/244743 | SYSTEMS AND METHODS FOR WAFER PROCESSING WITH SENSOR TECHNOLOGIES | US2025/022695 | H01L 21/67 | TOKYO ELECTRON LIMITED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/244755 | LOW-TEMPERATURE/BEOL-COMPATIBLE HIGHLY SCALABLE GRAPHENE SYNTHESIS TOOLS INCLUDING RETASKED TOOLS | US2025/024164 | H01L 21/3205 | DESTINATION 2D INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/244756 | THERMALLY AND ELECTRICALLY CONDUCTIVE ADHESIVE FOR GROUNDING AND THERMAL GAP FILLING OF ELECTRODES | US2025/024168 | H01L 21/67 | APPLIED MATERIALS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/244763 | STRUCTURES AND METHODS FOR INTEGRATED COLD PLATE IN XPUS AND MEMORY | US2025/025179 | H01L 23/473 | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/244768 | CELL HEIGHT REDUCTION USING A DEEP POWER RAIL PROCESS | US2025/025434 | H01L 23/528 | QUALCOMM INCORPORATED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/244770 | PILLAR WITH EMBEDDED CAPACITOR | US2025/025567 | H01L 23/64 | QUALCOMM INCORPORATED | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/244795 | INTEGRATED WET PASSIVATION ON CMP FOR HYBRID BONDING POST-CU PAD POLISH CAPPING | US2025/026747 | H01L 23/00 | APPLIED MATERIALS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/244809 | DUMMY FEATURES FOR DISSIPATING HEAT IN PACKAGES INCLUDING ADVANCED SEMICONDUCTOR CHIPS | US2025/027321 | H01L 23/373 | APPLIED MATERIALS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/244810 | BONDING USING TRANSPARENT CONDUCTIVE MATERIALS AND TRANSPARENT DIELECTRIC MATERIALS | US2025/027327 | H01L 23/00 | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/244811 | STACKING OF OPTICAL STRUCTURES USING CONDUCTIVE MATERIALS AND REFLECTORS | US2025/027328 | H01L 25/16 | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/244848 | WIRE BONDING SYSTEMS AND ARRAYS, AND RELATED METHODS | US2025/028344 | H01L 23/00 | KULICKE AND SOFFA INDUSTRIES, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/244909 | CARBON COATED SILICON CARBIDE VACUUM WAFER CHUCK TO CONTROL ELECTROSTATIC DISCHARGE TO WAFER | US2025/029452 | H01L 21/687 | KLA CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/244929 | ON-DIE HEATING DURING MEMORY DIE OPERATION | US2025/029607 | H01L 21/66 | MICRON TECHNOLOGY, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/244987 | CRYOGENIC ETCH USING ACID FORMING GAS | US2025/029971 | H01L 21/311 | LAM RESEARCH CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/244994 | SELECTIVE ETCH OF STACK USING A NITROGEN AND FLUORINE CONTAINING GAS | US2025/029980 | H01L 21/311 | LAM RESEARCH CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/245099 | INCREASED LIFE SUBSTRATE SUPPORT ASSEMBLY | US2025/030179 | H01L 21/687 | APPLIED MATERIALS, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/245114 | DICING MULTI-DIE MEMORY STACKS | US2025/030197 | H01L 23/00 | MICRON TECHNOLOGY, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/245154 | METALLIZATION PRECURSORS AND ONBOARD COMBINATORIAL CHEMICAL SYNTHESIS | US2025/030255 | H01L 21/285 | LAM RESEARCH CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/245156 | METHOD OF FORMING STACKED SEMICONDUCTOR DEVICES WITH CARBON NANOFIBER STRUCTURES AND ASSOCIATED SYSTEMS AND METHODS | US2025/030258 | H01L 23/373 | MICRON TECHNOLOGY, INC. | ELECTRICITY | الکتریسیته | دانش هسته ای | 2025 | 48 | WO/2025/245194 | COOLING SLEEVE FOR PROCESSING TOOL VALVE | US2025/030326 | H01L 21/67 | LAM RESEARCH CORPORATION | ELECTRICITY | الکتریسیته | دانش هسته ای |