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سالهفتهIDTitleApplNoIPCApplicantSubgroupزیر گروهرشته شرحDescription
202548WO/2025/199997LIGHT-EMITTING SUBSTRATE AND PREPARATION METHOD THEREFOR, AND DISPLAY DEVICECN2024/084978H01L 33/24BOE TECHNOLOGY GROUP CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/241051DEVICE COOLING AND ELECTROMAGNETIC INTERFERENCE SHIELDING SYSTEMCN2024/094124H01L 23/552QUALCOMM INCORPORATEDELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/241114APPARATUS AND METHOD FOR THE ALIGNMENT OF A SUBSTRATE SUPPORTCN2024/094753H01L 21/68APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/241276LIGHT-EMITTING DEVICE, LAMP PANEL AND DISPLAY APPARATUSCN2024/104658H01L 25/16HGC (WUHAN) TECHNOLOGY CO., LTDELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/241317CASSETTE-FREE CLEANING METHOD FOR ULTRATHIN FZ SILICON WAFERCN2024/110878H01L 21/02SHANGHAI SEMICONDUCTOR WAFER TECHNOLOGY CO., LTDELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/241382PHOTOVOLTAIC MODULECN2024/124260H01L 31/048SHENZHEN HELLO TECH ENERGY CO., LTDELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/241395SEMICONDUCTOR STRUCTURE, AND SEMICONDUCTOR DEVICE AND FORMING METHOD THEREFORCN2024/126302H01L 23/31CXMT CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/241706RADIO FREQUENCY FRONT-END ASSEMBLY, RADIO FREQUENCY TRANSCEIVING SYSTEM AND COMMUNICATION DEVICECN2025/085928H01L 25/16HUAWEI TECHNOLOGIES CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/241784REST-STATE BIO-OPTICAL SPECTRUM LED LIGHT SOURCE AND MANUFACTURING METHOD THEREFORCN2025/089343H01L 25/075DONGGUAN LEDESTAR OPTOELECTRONICS TECHNOLOGY CO., LTDELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/241785BIO-FRIENDLY LIGHT SPECTRUM LED LIGHT SOURCE FOR WORK AND OFFICE ENVIRONMENTS, AND MANUFACTURING METHOD THEREFORCN2025/089349H01L 25/075DONGGUAN LEDESTAR OPTOELECTRONICS TECHNOLOGY CO., LTDELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/241786STUDY-STATE BIO-OPTICAL SPECTRUM LED LIGHT SOURCE AND MANUFACTURING METHOD THEREFORCN2025/089350H01L 25/075DONGGUAN LEDESTAR OPTOELECTRONICS TECHNOLOGY CO., LTDELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/2418203D VERTICAL INTERCONNECTION PACKAGING STRUCTURE AND PREPARATION METHOD THEREFORCN2025/090653H01L 21/768SJ SEMICONDUCTOR (JIANGYIN) CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/241846EMBEDDED PACKAGING STRUCTURE, POWER SUPPLY, AND MANUFACTURING METHODCN2025/091751H01L 25/16HUAWEI TECHNOLOGIES CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/2418933D VERTICAL INTERCONNECTION PACKAGING STRUCTURE AND PREPARATION METHOD THEREFORCN2025/093607H01L 21/768SJ SEMICONDUCTOR (JIANGYIN) CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/241894PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFORCN2025/093614H01L 23/31SJ SEMICONDUCTOR (JIANGYIN) CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/241905LIGHT-EMITTING ELEMENT PICKUP SEQUENCE DETERMINATION METHOD, LIGHT-EMITTING ELEMENT PICKUP METHOD, LIGHT-EMITTING ELEMENT TRANSFER METHOD, APPARATUS, DEVICE AND MEDIUMCN2025/093725H01L 21/67BOE TECHNOLOGY GROUP CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/241940BEARING APPARATUS AND SEMICONDUCTOR PROCESSING DEVICECN2025/094507H01L 21/683BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/241974WAFER TRANSFER SYSTEMCN2025/095027H01L 21/677ETA-SEMITECH (ZHEJIANG) CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/242266METHOD FOR PRODUCING AN ARRAY COMPRISING UV LIGHT-EMITTING DIODES, AND ARRAYDE2025/100471H01L 25/075MSG LITHOGLAS GMBHELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/242350APPARATUS AND METHOD FOR CONTINUOUS DIE BONDINGEP2025/059090H01L 21/67ASML NETHERLANDS B.V.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/242628COOLER FOR COOLING POWER SEMICONDUCTORSEP2025/063746H01L 21/48ROBERT BOSCH GMBHELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/242641COOLER ARRANGEMENT AND METHOD FOR PRODUCING SAMEEP2025/063779H01L 23/367ROBERT BOSCH GMBHELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/242966TEST STRUCTURE AND FABRICATING METHOD THEREOFFI2025/050265H01L 21/66CHIPMETRICS OYELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/243384SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICEJP2024/018627H01L 23/40MITSUBISHI ELECTRIC CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/243391SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICEJP2024/018675H01L 29/778MITSUBISHI ELECTRIC CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/243406POWER CONVERSION DEVICEJP2024/018730H01L 23/48ASTEMO, LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/243478METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, AND RESIN SET FOR SEALING AND UNDERFILL FORMATION IN SEMICONDUCTOR CHIP COMPONENTJP2024/019078H01L 23/31RESONAC CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/243527SEMICONDUCTOR DEVICEJP2024/019248H01L 23/12RESONAC CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/243529METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, THERMOSETTING ADHESIVE FOR SEMICONDUCTOR PACKAGE, SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR MODULEJP2024/019251H01L 23/12RESONAC CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/243602COOLING STRUCTUREJP2025/002463H01L 23/473HITACHI, LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/243620ELECTRONIC COMPONENT EQUIPPED WITH ADHESIVE SHEET, AND TRANSFER SHEETJP2025/005373H01L 21/301RESONAC CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/243629ELECTRON BEAM LITHOGRAPHY DEVICE AND ELECTRON BEAM LITHOGRAPHY METHODJP2025/006000H01L 21/027NUFLARE TECHNOLOGY, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/243727POWER SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICEJP2025/014493H01L 23/467MITSUBISHI ELECTRIC CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/243738FILM THICKNESS MEASUREMENT METHODJP2025/014947H01L 21/306SCREEN HOLDINGS CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/243743METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, WAFER LAMINATE, AND SEMICONDUCTOR CHIPJP2025/015077H01L 21/301KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHOELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/243744METHOD FOR MANUFACTURING SEMICONDUCTOR WAFER, AND SEMICONDUCTOR WAFERJP2025/015078H01L 21/301KABUSHIKI KAISHA TOKAI RIKA DENKI SEISAKUSHOELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/243755SUBSTRATE TRANSPORT SYSTEMJP2025/015476H01L 21/677KAWASAKI JUKOGYO KABUSHIKI KAISHAELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/243782GAS SUPPLY DEVICE, GAS SUPPLY SYSTEM, AND GAS SUPPLY METHODJP2025/015963H01L 21/205TAIYO NIPPON SANSO CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/243783GAS SUPPLY DEVICE, GAS SUPPLY SYSTEM, AND GAS SUPPLY METHODJP2025/015964H01L 21/205TAIYO NIPPON SANSO CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/243784GAS SUPPLY DEVICE, GAS SUPPLY SYSTEM, AND GAS SUPPLY METHODJP2025/015965H01L 21/205TAIYO NIPPON SANSO CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/243813PACKAGE, LEAD FRAME, AND METHOD FOR MANUFACTURING PACKAGEJP2025/016462H01L 23/02SONY SEMICONDUCTOR SOLUTIONS CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/243917SURFACE TREATMENT METHOD FOR SEMICONDUCTOR SUBSTRATE, LIQUID COMPOSITION, AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATEJP2025/017656H01L 21/304MITSUBISHI GAS CHEMICAL COMPANY, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/243968BONDING DEVICE AND CONTROL METHODJP2025/017966H01L 21/60PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/244050CLEANING LIQUID COMPOSITIONJP2025/018316H01L 21/304KANTO KAGAKU KABUSHIKI KAISHAELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/244066SILICON ELECTRODE PLATE FOR PLASMA PROCESSING APPARATUS AND METHOD FOR MANUFACTURING SAMEJP2025/018439H01L 21/3065MITSUBISHI MATERIALS CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/244104METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, AND RESIN SET FOR SEALING AND UNDERFILL FORMATION IN SEMICONDUCTOR CHIP COMPONENTJP2025/018599H01L 21/60RESONAC CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/244145DISPLAY DEVICE INCLUDING SEMICONDUCTOR LIGHT-EMITTING ELEMENTSKR2024/006786H01L 25/075LG ELECTRONICS INC.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/244227COOLING DUCT FOR HUMIDITY CONTROLKR2024/096581H01L 21/67YEST CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/244308PROCESS MONITORING SYSTEM AND METHOD USING AUTOMATED SYSTEM AND WIRELESS CHARGINGKR2025/005559H01L 21/67WIT CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/244346LOAD LOCK CHAMBER AND SUBSTRATE PROCESSING APPARATUS INCLUDING SAMEKR2025/006543H01L 21/67PSK INC.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/244473TRANSPARENT DISPLAY DEVICEKR2025/007049H01L 23/00YAS CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/244474TRANSPARENT DISPLAY DEVICEKR2025/007050H01L 23/00YAS CO., LTD.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/244601A METHOD FOR COMPLETELY CLEANING THE DIE SEPARATION TAPE FROM THE DIE SURFACETR2024/051741H01L 21/3065BILKENT UNIVERSITESI ULUSAL NANOTEKNOLOJI ARASTIRMA MERKEZIELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/244626COMPOSITE THERMAL HOTSPOT MANAGEMENT IN DIE PACKAGINGUS2024/030242H01L 23/373DIAMOND FOUNDRY INCORPORATEDELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/244725STRESS CONTROL OF HIGH-DENSITY CARBON HARDMASK (CHM)US2025/019786H01L 21/033TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/244743SYSTEMS AND METHODS FOR WAFER PROCESSING WITH SENSOR TECHNOLOGIESUS2025/022695H01L 21/67TOKYO ELECTRON LIMITEDELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/244755LOW-TEMPERATURE/BEOL-COMPATIBLE HIGHLY SCALABLE GRAPHENE SYNTHESIS TOOLS INCLUDING RETASKED TOOLSUS2025/024164H01L 21/3205DESTINATION 2D INC.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/244756THERMALLY AND ELECTRICALLY CONDUCTIVE ADHESIVE FOR GROUNDING AND THERMAL GAP FILLING OF ELECTRODESUS2025/024168H01L 21/67APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/244763STRUCTURES AND METHODS FOR INTEGRATED COLD PLATE IN XPUS AND MEMORYUS2025/025179H01L 23/473ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/244768CELL HEIGHT REDUCTION USING A DEEP POWER RAIL PROCESSUS2025/025434H01L 23/528QUALCOMM INCORPORATEDELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/244770PILLAR WITH EMBEDDED CAPACITORUS2025/025567H01L 23/64QUALCOMM INCORPORATEDELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/244795INTEGRATED WET PASSIVATION ON CMP FOR HYBRID BONDING POST-CU PAD POLISH CAPPINGUS2025/026747H01L 23/00APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/244809DUMMY FEATURES FOR DISSIPATING HEAT IN PACKAGES INCLUDING ADVANCED SEMICONDUCTOR CHIPSUS2025/027321H01L 23/373APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/244810BONDING USING TRANSPARENT CONDUCTIVE MATERIALS AND TRANSPARENT DIELECTRIC MATERIALSUS2025/027327H01L 23/00ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/244811STACKING OF OPTICAL STRUCTURES USING CONDUCTIVE MATERIALS AND REFLECTORSUS2025/027328H01L 25/16ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/244848WIRE BONDING SYSTEMS AND ARRAYS, AND RELATED METHODSUS2025/028344H01L 23/00KULICKE AND SOFFA INDUSTRIES, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/244909CARBON COATED SILICON CARBIDE VACUUM WAFER CHUCK TO CONTROL ELECTROSTATIC DISCHARGE TO WAFERUS2025/029452H01L 21/687KLA CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/244929ON-DIE HEATING DURING MEMORY DIE OPERATIONUS2025/029607H01L 21/66MICRON TECHNOLOGY, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/244987CRYOGENIC ETCH USING ACID FORMING GASUS2025/029971H01L 21/311LAM RESEARCH CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/244994SELECTIVE ETCH OF STACK USING A NITROGEN AND FLUORINE CONTAINING GASUS2025/029980H01L 21/311LAM RESEARCH CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/245099INCREASED LIFE SUBSTRATE SUPPORT ASSEMBLYUS2025/030179H01L 21/687APPLIED MATERIALS, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/245114DICING MULTI-DIE MEMORY STACKSUS2025/030197H01L 23/00MICRON TECHNOLOGY, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/245154METALLIZATION PRECURSORS AND ONBOARD COMBINATORIAL CHEMICAL SYNTHESISUS2025/030255H01L 21/285LAM RESEARCH CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/245156METHOD OF FORMING STACKED SEMICONDUCTOR DEVICES WITH CARBON NANOFIBER STRUCTURES AND ASSOCIATED SYSTEMS AND METHODSUS2025/030258H01L 23/373MICRON TECHNOLOGY, INC.ELECTRICITYالکتریسیتهدانش هسته ای
202548WO/2025/245194COOLING SLEEVE FOR PROCESSING TOOL VALVEUS2025/030326H01L 21/67LAM RESEARCH CORPORATIONELECTRICITYالکتریسیتهدانش هسته ای